| Frame No Frame |
Hyperscript"Semiconductor Technology"© H. Föll Blue: Backbone IRed: Backbone II |
Index Matrix of Modules |
|
1.1 Scope of the Course | |||
|
General outline, relation to other courses, books | |||
|
Required background knowledge | |||
|
Organizational remarks | |||
|
Exercises, Seminar | |||
|
1.2 Motivation for the Content | |||
|
General remarks | |||
|
Products, Components and Materials | |||
2. Semiconductor Materials and Products
|
2.1 General Chemistry and Structure | ||
|
Elemental Semiconductors | ||
|
Compound Semiconductors | ||
|
Some Relevant Properties | ||
|
2.2 Silicon | ||
|
Silicon and Microelectronics | ||
|
Other uses of Silicon | ||
|
2.3 III-V Semiconductors | ||
|
Basic Properties and Optoelectronics | ||
|
Other Products | ||
|
2.4 Other Semiconductors and Products | ||
|
Germanium and SiC | ||
|
II-VI Semiconductors | ||
|
CuInSe2 and other Chalkogenides | ||
|
Organic Semconductors | ||
|
2.5 Exotic Semiconductors, Processes and Products | ||
|
Porous Semiconductors and Product Ideas | ||
|
Sensors | ||
|
3.1 General | ||
|
General Remarks, Definitions | ||
|
Applications | ||
|
3.2 Mechanical Properties | ||
|
Geometry and Topology | ||
|
Adhesion | ||
|
Stress and Strain | ||
|
3.3 Nucleation and Growth | ||
|
In the Beginning | ||
|
Nucleation and Growth Modes | ||
|
3.4 Structure, Interfaces and Properties | ||
|
Epitaxy and misfit dislocations | ||
|
Film structure | ||
|
Special properties of thinn films | ||
|
3.5 Properties Measurements and Characterization | ||
|
General properties | ||
|
Important techniques | ||
|
Structural properties | ||
|
4.1 Input to Si Processing in an Industrial Environment | ||
|
From Wafer to Product | ||
|
Producing Semiconductor-Grade Silicon | ||
|
Making wafers | ||
|
4.2 Other Semiconductor Crystal Growth Technologies | ||
|
Single Crystals other than Si | ||
|
No Need for single crystals | ||
| |
4.3 Infrastructure | ||
|
Clean room, Particles and Contamination | ||
|
Testing and Packaging | ||
|
People and Money | ||
|
Generation Sequences | ||
5. Integrated Circuits - Process Integration
|
5.1 Basic Considerations for Process Integration | ||
|
What is Integration? | ||
|
Basic Concepts of Integrating Bipolar Transistors | ||
|
Basic Concepts of Connecting Transistors | ||
|
Integrated MOS Transistors | ||
|
Integrated CMOS Technology | ||
|
5.2 Process Integration | ||
|
Chips on Wafers | ||
|
Packaging Si Chips | ||
|
5.3 Money, Markets and Management | ||
|
Moore's law and exponential growth | ||
6. Materials and Processes for Silicon Technology
|
6.1 Si Oxides and LOCOS Process | ||
|
The Importance of Silicon Dioxide | ||
|
LOCOS | ||
|
6.2 Chemical Vapor Deposition | ||
|
Si epitaxy | ||
|
Oxide CVD | ||
|
CVD for Poly-Silicon, Silicon Nitride and Miscellaneous Materials | ||
|
6.3. Physical Processes for Layer Deposition | ||
|
Sputter Deposition and Contact Hole Filling | ||
|
Ion Implantation | ||
|
Miscellaneous Techniques and Comparison | ||
|
6.4 Etching Techniques | ||
|
General remarks and chmical etching | ||
|
Plasma etching | ||
|
6.5 Lithography | ||
|
Basic Lithography Techniques | ||
|
Resist and Steppers | ||
|
Products and Developments | ||
|
What is MEMS? | ||
|
A Closer Look of a Few Selected Products | ||
|
Sensors and Actuators | ||
|
Processes and Specialties | ||
|
Processes and Materials - General Consideration | ||
|
Key processes | ||
|
Process integration | ||
|
8.1 General Concerns | ||
|
Basic Solar Cell Topics | ||
|
Solar Cell Current-Voltage Characteristics and Equivalent Circuit Diagram | ||
|
8.2 Making Bulk Solar Cells | ||
|
Production Necessities and Silicon Starting Material | ||
|
Processes and Process Integration | ||
|
8.3 Thin Film Solar Cells | ||
|
Types of Thin Film Solar Cells | ||
|
Producing thin film SC's | ||
|
9.1 General Concerns | ||
|
Semiconductors and Light | ||
|
Optoelectronic Devices | ||
|
9.2 Important Principles and Technologies | ||
|
LED's | ||
|
Laser diodes | ||