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Hyperscript"Electronic Materials"© H. Föll Table of Contents |
Hyperscripts of AMAT: General Information Index |
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1.1 Scope of the Course | ||
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General outline, relation to other courses, books | ||
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Required background knowledge | ||
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Organizational remarks | ||
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Exercises, Seminar | ||
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1.2 Introduction to the Course | ||
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General remarks | ||
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Looking at products, components, materials | ||
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1.3 Required Reading and Exercises | ||
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General remarks | ||
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Required Reading | ||
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2.1 Definitions and General Properties | ||
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Metals | ||
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Alloys | ||
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Non-metals | ||
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2.2 General Applications | ||
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Conductors | ||
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Contacts | ||
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Resistors and heating elements | ||
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2.3 Special Applications | ||
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Thermionic emission, field effects and tunneling | ||
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Thermoelectric effects | ||
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2.4 Ionic Conductors | ||
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General remarks | ||
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Debye length and Nernsts Law | ||
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3.1 Definitions and General Relations | ||
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Fields, polarisation, dipoles, susceptibility, dielectric constants. | ||
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Capacitors, surface charge and dipole moments | ||
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3.2 Mechanisms of Polarization | ||
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Electronic polarisation | ||
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Ionic polarisation | ||
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Orientation polarisation | ||
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Relation between microscopic and macroscopic quantities | ||
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3.3 Frequency Dependence of the Dielectric Constant | ||
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Dipole relaxation | ||
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Resonant absorption | ||
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Dielectric function | ||
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3.4 Dynamic Properties | ||
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Dielectric losses | ||
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3.5 Dielectric breakdown | ||
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General Observation and Failure | ||
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Mechanisms | ||
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3.6 Special Dielectrics | ||
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Piezoelectricity and related effects | ||
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Ferroelectricity | ||
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3.7 Dielectrics and Optics | ||
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Basics | ||
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Complex index of refraction | ||
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4.1 Definitions and General Relations | ||
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Definitions and general relations | ||
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Fields, fluxes and permeability | ||
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Origin of Magnetic Dipoles | ||
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Classifications of Interactions and Types of Magnetism | ||
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4.2 Dia- and Paramagnetism | ||
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Diamagnetism | ||
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Paramagnetism | ||
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4.3 Ferromagetism | ||
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Mean field model | ||
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Magnetic domains | ||
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Magnetization and domain movement | ||
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Hard and soft magnets, uses | ||
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4.4 Technical Materials and Applications | ||
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Magnetic materials general | ||
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Magnetic data storage | ||
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5.0 Required reading | ||
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Basic bipolar and MOS transistor | ||
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5.1 General Aspects of Silicon Technology | ||
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Basic problems and concepts for integration | ||
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Integrated MOS transistor | ||
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Integrated CMOS transistor | ||
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5.2 Process Integration | ||
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Chips on wafers | ||
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Packaging and testing | ||
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Management requirements | ||
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5.3 Cleanrooms, Particles and Contamination | ||
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Cleanrooms and Defects | ||
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5.4 Development and Production of a New Chip Generation | ||
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Money, time, and management | ||
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Working in chip development and production | ||
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Generation Sequences | ||
6. Materials and Processes for Silicon Technology
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6.1 Silicon | ||
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Producing Semiconductor-Grade Silicon | ||
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Silicon Crystal Growth | ||
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6.2 Si Oxide and Doping | ||
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Oxidation; LOCOS process | ||
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6.3 Chemical Vapor Deposition | ||
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Epitaxy and CVD processes | ||
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Oxid, nitride and other CVD deposition processes | ||
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6.4 Physical Processes for Layer Deposition | ||
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Sputter deposition and contact hole filling | ||
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Ion implantation | ||
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Miscellaneous techniques and comparison | ||
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6.5 Etching Techniques | ||
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Chemical etching | ||
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Plasma etching | ||
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6.6 Lithography | ||
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Basic lithography techniques | ||
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Resist and steppers | ||