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Semiconductor technology is almost synonymous with thin film technology. |
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A thin film is always adhering to a substrate and (at least originally) continuous. | |||||
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Thin films may still be found in the product or may have been "sacrificed" during the making of the product. | |||||
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An IC is a study of thin films in and on the Si substrate. | |||||
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The same is true for pretty much every semiconductor product. | |||||
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Thin always means "thin" relative to some intrinsic (internal) length scale. Examples are: |
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Structural length scales. | |||||
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Wavelength and Interaction length scales. | |||||
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Transport parameter length scales. | |||||
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Electrical scales. | |||||
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There are many thin film applications outside of semiconductor technology: | |||||
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Optical, electrical, chemical, mechanical, magnetic technologies use thin films. | |||||
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Thin films have other spatial properties besides their thickness. |
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Interface roughness and surface roughness R defined by their "root mean square": | ||||||||||||
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Thin films adhere to their substrate. |
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A direct measure of adhesion is the interfacial energy γAB between film A and substrate B. | ||||||||||||
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The phase diagram provides some guideline. Complete miscibility=good adhesion, (eutectic)) decomposition=(?) low adhesion. Calculations of γ are difficult. | ||||||||||||
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Full adhesion can only be obtained for films grown on a substrate. Adhesion energies can be measured. | ||||||||||||
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Generally, there will be stress σ and strain ε in a thin film and its substrate. |
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A major source of strain is the difference of the thermal expansion coefficients α. | ||||||||||||
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Stress in thin film may relax by many mechanisms, and this might be good or bad:
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Warpage can be a serious problem in semiconductor technology. | ||||||||||||
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Deposition of a thin layer must start with a "clean" substrate surface on which the first atomic / molecular layer of the film must nucleate. |
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There are many possible interactions between the substrate and "first" incoming atoms. | |||||
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As the interaction energy goes up we move from "some" absorption to physisorption (secondary bonds are formed) to chemisorption (full bonding) | |||||
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The sticking coefficient is a measure of the likelihood to find an incoming atom in the thin film forming. | |||||
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Immobilization by some bonding is more likely at defects (=more partners). The initial stage of nucleation is thus very defect sensitive. | |||||
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Simple surface steps qualify as efficient "defects" for nucleation. |
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Small deviations from perfect orientation provide large step densities. Nucleation therefore can be very sensitive to the precise {hkl} of the surface | |||||
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Intersections of (screw) dislocation lines with the surface also provide steps. | |||||
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This may cause grain boundaries and other defects in the growing layer. | |||||
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Scanning probe microscopy gives the experimental background | |||||
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There is always a nucleation barrier that has to be overcome for the first B-clusters" to form on A |
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the three involved interface energies, all expressed in the "wetting angle", plus
possibly some strain are the decisive inputs for the resulting growth mode.
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Epitaxial layers are crucial for semiconductor technology. |
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Misfit of lattice constants will produce strained layers upon epitaxial growth; strain relief happens by the formation of misfit dislocations. | |||||||||||
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Misfit dislocations must be avoided at all costs! | |||||||||||
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Below a usually rather small critical thickness dcrit of the the thin layer no misfit dislocations will occur. | |||||||||||
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Rule of thumb: 0.5 % misfit ⇒ dcrit ≈10 nm | |||||||||||
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The internal structure of thin films can be anything known from bulk materials plus some (important!) specialities. |
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Properties of thin films can be quite different from that of the bulk material. |
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The reason can be differences in length scales. | |||||||||||
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Semiconductor technology relies to some extent on superior thin film properties. | |||||||||||
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© H. Föll (Semiconductor Technology - Script)