| Intended Topics: | ||
| 4.1 Silicon on Insulator | ||
advantages and problems, basic device structure | ||
| Modern developments Oxygen Implantation; waferbonding, smart cut technology | ||
| 4.2 Etching of Silicon | ||
| Chemical etches Isotropic and anisotropic dissolution, defect etches and anodic etching | ||
| Micromechanics and microsystem technology Basic considerations, special process steps |
||
| Electrochemical etching, Porous Silicon and applications Photonic crystals, filters, sensors, microtechnology, integrated wave guides, ... | ||
| 4.3 Specialities | ||
| Amorphes Si and applications Structural and electronic properties, H - passivation, solar cells and FPDs | ||
| SiGe: Materials ascpects and devices HEMT, detectors (incl. Ge), | ||
© H. Föll (Semiconductors - Script)