Processes and Materials II

Here is the rest of the processes

A few more materials are needed, especially solids in the form of "sputter targets".

A great total of about 450 process- and control steps are needed.

	We don't have a chip yet - we only have unpackaged chips on a wafer.
		Next, the wafer has to be cut and the chips that work (this needs a measurement) are packaged.
		Packaging, although not needing processes at very small dimensions, is not simple either.
		To continue, use the link