| 1 |
../kap_1/backbone/r1.html: Contents of Chapter 1 To : 2, 3, 4, From : 0, 2, 5, 53, Pics : 1, 2, 3, |
| 2 |
../kap_1/backbone/r1_1_1.html: 1.1.1 Introduction To : 5, 6, 7, 8, 9, 4, 1, 3, 10, From : 1, 3, 5, 53, 55, 282, 568, Pics : 4, 5, 1, 2, 3, 6, |
| 3 |
../kap_1/backbone/r1_2_1.html: 1.2.1 Motivation for the Conten To : 11, 12, 13, 4, 2, 14, 15, From : 1, 2, 5, 12, 14, 55, 318, 568, Pics : 4, 5, 7, 8, 1, 2, 3, 6, |
| 4 |
../index.html: Semiconductor Technology To : From : 1, 2, 3, 5, 6, 7, 12, 14, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 53, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 80, 81, 85, 87, 89, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 121, 131, 140, 141, 142, 143, 144, 145, 146, 147, 148, 149, 150, 152, 156, 157, 158, 159, 160, 162, 164, 165, 166, 167, 168, 169, 170, 171, 172, 173, 175, 177, 178, 179, 180, 182, 183, 184, 185, 186, 187, 188, 189, 190, 191, 192, 193, 194, 195, 196, 198, 199, 201, 204, 205, 206, 207, 208, 212, 213, 214, 215, 216, 217, 218, 219, 221, 222, 223, 225, 227, 228, 229, 230, 231, 232, 233, 234, 235, 242, 248, 249, 250, 251, 253, 256, 258, 259, 260, 261, 262, 269, 270, 276, 282, 285, 296, 299, 303, 304, 309, 312, 314, 318, 324, 327, 333, 336, 340, 344, 352, 358, 369, 371, 372, 373, 374, 375, 377, 378, 380, 382, 385, 388, 390, 392, 394, 395, 397, 405, 406, 407, 408, 409, 410, 414, 415, 418, 420, 421, 424, 426, 427, 442, 443, 444, 446, 448, 450, 453, 455, 456, 463, 466, 469, 472, 481, 492, 495, 499, 501, 509, 510, 512, 513, 515, 519, 521, 523, 525, 529, 530, 535, 538, 539, 541, 550, 554, 556, 558, 607, 630, 642, 645, 657, 672, Pics : |
| 5 |
../metamod/backbone.html: "Semiconductor Technology" Backbone I special To : 4, 16, 1, 2, 3, 14, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, From : 2, Pics : 4, 5, |
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../running_term/index.html: Semiconductor Technology: Index To : 4, 6, 9, 52, 53, From : 2, 6, Pics : 4, 9, 5, |
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../metamod/books.html: Books To : 4, 16, 52, From : 2, 23, 102, 104, 215, Pics : 4, 5, |
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../../matwissem_en/index.html: To : From : 2, 258, Pics : |
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../../hl_nano_en/index.html: To : From : 2, 6, 53, 282, Pics : |
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../kap_1/backbone/r1_1_1.pdf: To : From : 2, Pics : |
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../../elmat_en/kap_6/advanced/t6_1_4.html: To : From : 3, Pics : |
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../kap_1/illustr/i1_1_1.html: Semiconductor Products and Components To : 4, 54, 3, 55, From : 3, 55, 568, Pics : 4, 5, 1, 6, 10, |
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../../elmat_en/kap_5/backbone/r5_4_1.html: To : From : 3, 47, Pics : |
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../kap_2/backbone/r2.html: Contents of Chapter 2 To : 17, 56, 57, 58, 18, 59, 60, 19, 61, 62, 20, 63, 64, 65, 21, 66, 67, 4, 3, From : 3, 5, 17, 30, Pics : 1, 2, 3, |
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../kap_1/backbone/r1_2_1.pdf: To : From : 3, Pics : |
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../metamod/i_matrix.html: To : From : 5, 7, 53, 55, 282, 285, 568, Pics : |
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../kap_2/backbone/r2_1_1.html: 2.1.1 Basic Properties To : 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 4, 14, 56, 82, From : 5, 14, 56, 68, 80, 81, 312, 314, 415, Pics : 4, 5, 1, 2, 3, 6, |
| 18 |
../kap_2/backbone/r2_2_1.html: 2.2.1 Silicon and Microelectronics To : 83, 84, 85, 4, 58, 59, 86, From : 5, 14, 34, 58, 59, 85, 312, 318, Pics : 4, 11, 5, 12, 1, 2, 3, 6, |
| 19 |
../kap_2/backbone/r2_3_1.html: 2.3.1 III-V Semiconductors To : 87, 88, 89, 90, 91, -92, 4, 60, 61, 93, From : 5, 14, 20, 26, 30, 50, 60, 61, 63, 87, 89, 258, 304, 312, 324, Pics : 4, 5, 13, 14, 15, 16, 1, 2, 3, 6, |
| 20 |
../kap_2/backbone/r2_4_1.html: 2.4.1 Germanium and SiC To : 94, 95, 19, 4, 62, 63, 96, From : 5, 14, 30, 62, 63, Pics : 4, 5, 17, 1, 2, 3, 6, |
| 21 |
../kap_2/backbone/r2_5_1.html: 2.5.1 Porous Semiconductors and Product Ideas To : 97, 4, 65, 66, 98, From : 5, 14, 37, 65, 66, 188, 215, 225, 296, Pics : 4, 5, 18, 19, 20, 1, 2, 3, 6, |
| 22 |
../kap_3/backbone/r3.html: Contents of Chapter 3 To : 23, 99, 100, 24, 101, 102, 103, 25, 104, 105, 26, 106, 107, 108, 27, 109, 110, 111, 112, 4, 67, From : 5, 23, 67, Pics : 1, 2, 3, |
| 23 |
../kap_3/backbone/r3_1_1.html: 3.1.1 General Remarks and Some Definitions To : 7, 113, 114, 115, 116, 4, 22, 99, 117, From : 5, 22, 24, 50, 99, 107, 113, 327, 358, Pics : 4, 5, 21, 22, 23, 24, 1, 2, 3, 6, |
| 24 |
../kap_3/backbone/r3_2_1.html: 3.2.1 Geometry and Topology To : 118, 119, 23, 4, 100, 101, 120, From : 5, 22, 100, 101, 106, Pics : 4, 25, 5, 26, 27, 28, 29, 1, 2, 3, 6, |
| 25 |
../kap_3/backbone/r3_3_1.html: 3.3.1 In the Beginning To : 121, 122, 123, 124, 125, 69, 126, 127, 128, 129, -130, 131, 4, 103, 104, 132, From : 5, 22, 51, 103, 104, 121, 131, Pics : 4, 5, 30, 31, 32, 33, 1, 2, 3, 6, |
| 26 |
../kap_3/backbone/r3_4_1.html: 3.4.1 Single Crystalline Thin Films To : 99, 19, 133, 69, 134, 135, 136, 4, 105, 106, 137, From : 5, 22, 30, 38, 48, 51, 101, 105, 106, 173, 303, 554, Pics : 4, 5, 34, 35, 36, 37, 1, 2, 3, 6, |
| 27 |
../kap_3/backbone/r3_5_1.html: 3.5.1 More Properties To : 138, 4, 108, 109, 139, From : 5, 22, 107, 108, 109, 173, Pics : 4, 5, 1, 2, 3, 6, |
| 28 |
../kap_4/backbone/r4.html: Contents of Chapter 4 To : 29, 140, 141, 142, 30, 143, 144, 31, 145, 146, 147, 148, 149, 4, 112, From : 5, 29, 112, Pics : 1, 2, 3, |
| 29 |
../kap_4/backbone/r4_1_1.html: 4.1.1 From Wafer to Product To : 150, 4, 28, 140, 151, From : 5, 28, 140, 147, 150, 175, Pics : 4, 38, 5, 39, 40, 1, 2, 3, 6, |
| 30 |
../kap_4/backbone/r4_2_1.html: 4.2.1 Single Crystals Other Than Si To : 19, 26, 141, 152, 153, 102, 20, 63, 14, 154, 4, 142, 143, 155, From : 5, 28, 47, 142, 143, 152, 554, Pics : 4, 5, 41, 42, 43, 44, 45, 1, 2, 3, 6, |
| 31 |
../kap_4/backbone/r4_3_1.html: 4.3.1 Cleanrooms, Particles and Contamination To : 156, 157, 158, 159, 160, 161, 162, 4, 144, 145, 163, From : 5, 28, 35, 37, 41, 144, 145, 156, 157, 158, 159, 160, 162, 193, 229, Pics : 4, 5, 46, 47, 48, 1, 2, 3, 6, |
| 32 |
../kap_5/backbone/r5.html: Contents of Chapter 5 To : 33, 164, 165, 166, 167, 168, 34, 169, 170, 35, 171, 4, 149, From : 5, 33, 39, 149, Pics : 1, 2, 3, |
| 33 |
../kap_5/backbone/r5_1_1.html: 5.1.1 What is Intergration? To : 84, 83, 172, 173, 4, 32, 164, 174, From : 5, 32, 164, 172, 173, 182, Pics : 4, 5, 49, 50, 1, 2, 3, 6, |
| 34 |
../kap_5/backbone/r5_2_1.html: 5.2.1 Chips on Wafers To : 18, 175, 167, 150, 4, 168, 169, 176, From : 5, 32, 37, 39, 40, 41, 150, 168, 169, 175, 190, Pics : 4, 5, 51, 52, 1, 2, 3, 6, |
| 35 |
../kap_5/backbone/r5_3_1.html: 5.3.1 Moore's Law and what it Means To : 31, 177, 178, 179, 180, 4, 170, 171, 181, From : 5, 32, 41, 44, 47, 170, 171, 177, 178, 179, 180, 187, 193, 529, Pics : 4, 5, 53, 54, 55, 56, 1, 2, 3, 6, |
| 36 |
../kap_6/backbone/r6.html: Contents of Chapter 6 To : 37, 182, 183, 38, 184, 185, 186, 39, 187, 188, 189, 40, 190, 191, 192, 41, 193, 194, 195, 4, 171, From : 5, 37, 106, 171, 231, Pics : 1, 2, 3, |
| 37 |
../kap_6/backbone/r6_1_1.html: 6.1.1 Si Oxide To : 196, 197, 198, 166, 199, 165, 200, 34, 140, 188, 21, 201, 102, 31, 182, 4, 36, 202, From : 5, 36, 182, 184, 185, 187, 196, 198, 199, 201, 216, 455, Pics : 4, 5, 57, 58, 59, 60, 1, 2, 3, 6, |
| 38 |
../kap_6/backbone/r6_2_1.html: 6.2.1 Chemical Vapor Deposition To : 26, 140, 164, 4, 183, 184, 203, From : 5, 36, 51, 183, 184, 185, 216, 455, Pics : 4, 5, 61, 62, 63, 1, 2, 3, 6, |
| 39 |
../kap_6/backbone/r6_3_1.html: 6.3.1 Physical Processes for Layer Deposition To : 34, 185, 188, 166, 204, 32, 205, 206, 207, 80, 187, 208, 4, 186, 209, From : 5, 36, 40, 80, 186, 187, 188, 199, 204, 205, 206, 207, 208, 213, 229, 466, Pics : 4, 5, 64, 65, 66, 1, 2, 3, 6, |
| 40 |
../kap_6/backbone/r6_4_1.html: 6.4.1 Etching Techniques To : 34, 39, 4, 189, 190, 210, From : 5, 36, 189, 190, 215, 229, Pics : 4, 5, 67, 1, 2, 3, 6, |
| 41 |
../kap_6/backbone/r6_5_1.html: 6.5.1 Lithography To : 34, 146, 31, 35, 4, 192, 193, 211, From : 5, 36, 192, 193, 216, 229, 469, Pics : 4, 5, 68, 69, 70, 71, 72, 1, 2, 3, 6, |
| 42 |
../kap_7/backbone/r7.html: Contents of Chapter 7 To : 43, 212, 213, 214, 44, 215, 216, 217, 218, 4, 195, From : 5, 43, 59, 195, 318, Pics : 1, 2, 3, |
| 43 |
../kap_7/backbone/r7_1_1.html: 7.1.1 What is MEMS? To : 219, 220, 212, 221, 143, 222, 223, 4, 42, 224, From : 5, 42, 44, 212, 213, 219, 221, 222, 223, 495, 501, Pics : 4, 5, 73, 74, 75, 76, 77, 78, 79, 1, 2, 3, 6, |
| 44 |
../kap_7/backbone/r7_2_1.html: 7.2.1 Processes and Materials - General Consideration To : 43, 212, 225, 213, 35, 4, 214, 215, 226, From : 5, 42, 214, 215, 216, 225, 495, 501, Pics : 4, 5, 80, 81, 82, 1, 2, 3, 6, |
| 45 |
../kap_8/backbone/r8.html: Contents of Chapter 8 To : 46, 227, 228, 47, 229, 230, 48, 231, 232, 233, 4, 218, From : 5, 46, 218, Pics : 1, 2, 3, |
| 46 |
../kap_8/backbone/r8_1_1.html: 8.1.1 Basic Solar Cell Topics To : 234, 235, 236, 237, 238, 239, 240, 241, 242, -243, 244, 245, 88, 246, 247, 227, 248, 249, 250, 251, 231, 4, 45, 252, From : 5, 45, 47, 227, 231, 234, 235, 242, 248, 249, 250, 251, 510, Pics : 4, 5, 83, 84, 85, 86, 1, 2, 3, 6, |
| 47 |
../kap_8/backbone/r8_2_1.html: 8.2.1 Materials and Processes To : 46, 253, 35, 13, 141, 185, 140, 30, 215, 4, 228, 229, 254, From : 5, 45, 228, 229, 253, Pics : 4, 5, 87, 88, 89, 90, 91, 1, 2, 3, 6, |
| 48 |
../kap_8/backbone/r8_3_1.html: 8.3.1 Types of Thin Film Solar Cells To : 255, 256, 231, 229, 26, 4, 230, 257, From : 5, 45, 51, 230, 231, 256, Pics : 4, 92, 5, 93, 94, 95, 96, 97, 1, 2, 3, 6, |
| 49 |
../kap_9/backbone/r9.html: Contents of Chapter 9 To : 50, 258, 259, 51, 260, 261, 262, 4, 233, From : 5, 50, 233, Pics : 1, 2, 3, |
| 50 |
../kap_9/backbone/r9_1_1.html: 9.1.1 Semiconductors and Light To : 221, 167, 19, 263, 264, 265, 266, 23, 267, 268, 269, 270, 4, 49, 258, 271, From : 5, 49, 51, 221, 258, 269, 270, Pics : 4, 5, 1, 2, 3, 6, |
| 51 |
../kap_9/backbone/r9_2_1.html: 9.2.1 Light Emitting Diodes To : 50, 269, 258, 272, 247, 273, 274, 275, 26, 99, 48, 260, 38, 25, 276, 4, 259, 277, From : 5, 49, 231, 259, 260, 269, 276, Pics : 4, 5, 98, 99, 100, 101, 102, 103, 104, 1, 2, 3, 6, |
| 52 |
../../generalinfo_en/index.html: To : From : 6, 7, 53, 282, 285, Pics : |
| 53 |
../overview_main.html: Semiconductor Technology: Overview To : 1, -278, -279, 280, 281, 282, 9, 4, 2, 55, 52, 283, 16, 284, 285, 286, From : 6, Pics : 105, 4, 5, 106, |
| 54 |
../kap_1/illustr/i1_1_1.pdf: To : From : 12, Pics : |
| 55 |
../pecularities.html: Pecularities of Hyperscripts To : 287, 288, 289, 290, 16, 2, 12, 3, From : 12, 53, Pics : 4, 5, 1, |
| 56 |
../kap_2/backbone/r2_1_2.html: 2.1.2 Compound Semiconductors To : 255, 68, 4, 17, 57, 291, From : 14, 17, 57, 68, 312, 314, Pics : 4, 5, 1, 2, 3, 6, |
| 57 |
../kap_2/backbone/r2_1_3.html: 2.1.3 Some Relevant Properties To : 68, 70, 4, 56, 58, 292, From : 14, 56, 58, 68, 312, 314, Pics : 4, 5, 1, 2, 3, 6, |
| 58 |
../kap_2/backbone/r2_1_4.html: 2.1.4 Summary to: 2.1 General Chemistry and Structure To : 68, 4, 57, 18, 293, From : 14, 18, 57, 68, Pics : 4, 5, 1, 2, 3, 6, |
| 59 |
../kap_2/backbone/r2_2_2.html: 2.2.2 Other Uses of Silicon To : 239, 238, 294, 85, -295, 42, 296, 4, 18, 60, 297, From : 14, 18, 60, 85, 296, 312, 318, Pics : 4, 107, 5, 108, 1, 2, 3, 6, |
| 60 |
../kap_2/backbone/r2_2_3.html: 2.2.3 Summary to: 2.2. Silicon To : 85, 4, 59, 19, 298, From : 14, 19, 59, 85, Pics : 4, 109, 5, 110, 111, 1, 2, 3, 6, |
| 61 |
../kap_2/backbone/r2_3_2.html: 2.3.2 Other III-V Products To : 299, 4, 19, 62, 300, From : 14, 19, 62, 299, Pics : 4, 5, 1, 2, 3, 6, |
| 62 |
../kap_2/backbone/r2_3_3.html: 2.3.3 Summary to: 2.3. III-V Semiconductors To : 89, 4, 61, 20, 301, From : 14, 20, 61, 89, Pics : 4, 5, 112, 1, 2, 3, 6, |
| 63 |
../kap_2/backbone/r2_4_2.html: 2.4.2 II-VI Semiconductors To : 19, 302, 303, 4, 20, 304, 305, From : 14, 20, 30, 303, 304, Pics : 4, 5, 1, 2, 3, 6, |
| 64 |
../kap_2/backbone/r2_4_4.html: 2.4.4 Organic Semiconductors To : 306, 307, 4, 304, 65, 308, From : 14, 65, 258, 304, Pics : 4, 5, 1, 2, 3, 6, |
| 65 |
../kap_2/backbone/r2_4_5.html: 2.4.5 Summary to: 2.4: Other Semiconductors and Related Products To : 309, 4, 64, 21, 310, From : 14, 21, 64, 309, Pics : 4, 5, 1, 2, 3, 6, |
| 66 |
../kap_2/backbone/r2_5_2.html: 2.5.2 Sensors To : 4, 21, 67, 311, From : 14, 21, 67, Pics : 4, 1, 2, 3, 6, |
| 67 |
../kap_2/backbone/r2_6_1.html: 2.6.1 Summary to 2. Semiconductor Materials and Products To : 312, 4, 66, 22, 313, From : 14, 22, 66, 312, Pics : 4, 5, 109, 110, 111, 112, 1, 2, 3, 6, |
| 68 |
../kap_2/exercise/q2_1_1.html: Exercise Basic 2.1-1 All Class Exercises to 2.1 General Chemistry and Structure To : 17, 56, 57, 314, 4, 315, 58, From : 17, 56, 57, 58, 314, Pics : 4, 5, 113, 1, 6, 10, |
| 69 |
../../mw1_ge/kap_4/backbone/r4_1_3.html: To : From : 17, 25, 26, Pics : |
| 70 |
../../mw2_ge/kap_6/illustr/t6_1_1.html: To : From : 17, 57, Pics : |
| 71 |
../../mw1_ge/kap_4/backbone/r4_1_5.html: To : From : 17, 101, 121, Pics : |
| 72 |
../../mw1_ge/kap_2/basics/b2_1_4.html: To : From : 17, Pics : |
| 73 |
../../mw1_ge/kap_2/basics/erdalkali.html: To : From : 17, Pics : |
| 74 |
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| 75 |
../../mw1_ge/kap_2/basics/kohlenstoffgruppe.html: To : From : 17, 529, Pics : |
| 76 |
../../mw1_ge/kap_2/basics/stickstoffgruppe.html: To : From : 17, Pics : |
| 77 |
../../mw1_ge/kap_2/basics/chalkogene.html: To : From : 17, Pics : |
| 78 |
../../mw1_ge/kap_2/basics/halogene.html: To : From : 17, Pics : |
| 79 |
../../mw1_ge/kap_2/basics/edelgas.html: To : From : 17, Pics : |
| 80 |
../kap_2/advanced/t2_1_1.html: Germanium To : 4, 316, 17, 39, From : 17, 39, Pics : 4, 5, 1, 6, 10, |
| 81 |
../kap_2/advanced/t2_1_2.html: Selenium To : 4, 317, 17, From : 17, Pics : 4, 5, 114, 115, 116, 1, 6, 10, |
| 82 |
../kap_2/backbone/r2_1_1.pdf: To : From : 17, Pics : |
| 83 |
../../mw2_ge/kap_6/backbone/r6_4_3.html: To : From : 18, 33, Pics : |
| 84 |
../../mw2_ge/kap_6/backbone/r6_4_2.html: To : From : 18, 33, Pics : |
| 85 |
../kap_2/exercise/q2_2_1.html: Exercise Basic 2.2-1 All Quick Questions / Class Exercises to 2.2 Silicon To : 18, 59, 318, 4, 319, 60, From : 18, 59, 60, 318, Pics : 4, 5, 113, 1, 6, 10, |
| 86 |
../kap_2/backbone/r2_2_1.pdf: To : From : 18, Pics : |
| 87 |
../kap_2/illustr/i2_1_2.html: Zinc Blende and Wurtzite To : 320, 321, 322, 4, 323, 19, From : 19, Pics : 4, 5, 117, 118, 1, 6, 10, |
| 88 |
../../mw2_ge/kap_4/backbone/r4_3_2.html: To : From : 19, 46, 260, Pics : |
| 89 |
../kap_2/exercise/q2_3_1.html: Exercise 2.3-1: All Quick Questions / Class Exercises to 2.3 III-V Semiconductors To : 19, 324, 4, 325, 62, From : 19, 62, 324, Pics : 4, 5, 113, 1, 6, 10, |
| 90 |
../../semi_en/kap_5/backbone/r5_1_3.html: To : From : 19, Pics : |
| 91 |
../../mw2_ge/kap_4/backbone/r4_2_1.html: To : From : 19, Pics : |
| -92 |
http://www.et-te.com/products/illumination_arrays.html: From : 19, |
| 93 |
../kap_2/backbone/r2_3_1.pdf: To : From : 19, Pics : |
| 94 |
../../semi_en/index.html: To : From : 20, 172, Pics : |
| 95 |
../../semi_en/kap_a/backbone/ra_1_1.html: To : From : 20, Pics : |
| 96 |
../kap_2/backbone/r2_4_1.pdf: To : From : 20, Pics : |
| 97 |
../../elmat_en/kap_2/advanced/kiel_paper.pdf: To : From : 21, Pics : |
| 98 |
../kap_2/backbone/r2_5_1.pdf: To : From : 21, Pics : |
| 99 |
../kap_3/backbone/r3_1_2.html: 3.1.2 Applications of Thin Films To : 4, 23, 100, 326, From : 22, 23, 26, 51, 100, Pics : 4, 5, 119, 120, 121, 1, 2, 3, 6, |
| 100 |
../kap_3/backbone/r3_1_3.html: 3.1.3 Summary to: 3.1 Thin Films - General To : 327, 4, 99, 24, 328, From : 22, 24, 99, 327, Pics : 4, 122, 5, 1, 2, 3, 6, |
| 101 |
../kap_3/backbone/r3_2_2.html: 3.2.2 Adhesion To : 71, 329, 330, 26, 4, 24, 102, 331, From : 22, 24, 102, Pics : 4, 25, 5, 123, 124, 1, 2, 3, 6, |
| 102 |
../kap_3/backbone/r3_2_3.html: 3.2.3 Stress and Strain To : 332, 333, 334, 335, 138, 336, 337, 338, 7, 4, 101, 103, 339, From : 22, 30, 37, 101, 103, 333, 336, Pics : 4, 5, 125, 126, 127, 1, 2, 3, 6, |
| 103 |
../kap_3/backbone/r3_2_4.html: 3.2.4 Summary to: 3.2 Mechanical Properties To : 340, 4, 102, 25, 341, From : 22, 25, 102, 340, Pics : 4, 128, 5, 129, 130, 1, 2, 3, 6, |
| 104 |
../kap_3/backbone/r3_3_2.html: 3.3.2 Nucleation and Growth Modes To : 342, 152, 25, 7, 4, 105, 343, From : 22, 25, 105, 152, Pics : 4, 5, 131, 132, 133, 134, 135, 136, 1, 2, 3, 6, |
| 105 |
../kap_3/backbone/r3_3_3.html: 3.3.3 Summary to: 3.3 Nucleation and Growth To : 344, 4, 104, 26, 345, From : 22, 26, 104, 344, Pics : 4, 137, 5, 138, 132, 139, 140, 1, 2, 3, 6, |
| 106 |
../kap_3/backbone/r3_4_2.html: 3.4.2 Thin Film Structure To : 24, 36, 4, 26, 107, 346, From : 22, 26, 107, Pics : 4, 5, 141, 1, 2, 3, 6, |
| 107 |
../kap_3/backbone/r3_4_3.html: 3.4.3 Special Properties of Thin Films To : 27, 23, 329, 133, 138, 347, 348, 349, 115, 350, 4, 106, 108, 351, From : 22, 106, 108, 109, Pics : 4, 5, 1, 2, 3, 6, |
| 108 |
../kap_3/backbone/r3_4_4.html: 3.4.4 Summary to: 3.4 Structure, Interface and Some Properties To : 352, 4, 107, 27, 353, From : 22, 27, 107, 352, Pics : 4, 142, 5, 1, 2, 3, 6, |
| 109 |
../kap_3/backbone/r3_5_2.html: 3.5.2 Important Techniques To : 113, -354, 107, 4, 27, 110, 355, From : 22, 27, 110, 113, Pics : 4, 5, 1, 2, 3, 6, |
| 110 |
../kap_3/backbone/r3_5_3.html: 3.5.3 Local Properties To : 4, 109, 111, 356, From : 22, 109, 111, Pics : 4, 5, 143, 1, 2, 3, 6, |
| 111 |
../kap_3/backbone/r3_5_4.html: 3.5.4 Summary to: 3.5 Properties, Measurements and Characterization To : 4, 110, 112, 357, From : 22, 110, 112, Pics : 1, 2, 3, 6, |
| 112 |
../kap_3/backbone/r3_6_1.html: 3.6.1 Summary to: 3. Thin Films To : 358, 4, 111, 28, 359, From : 22, 28, 111, 358, Pics : 4, 122, 5, 128, 129, 130, 137, 138, 132, 139, 140, 142, 1, 2, 3, 6, |
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../kap_3/basics/b3_1_1.html: Interference Colors To : 360, 361, 362, 363, 4, 364, 23, 109, From : 23, 109, Pics : 4, 144, 5, 145, 1, 6, 10, |
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../../mw2_ge/kap_3/backbone/r3_2_1.html: To : From : 23, Pics : |
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../kap_3/illustr/oberflaechenstrukture.pdf: To : From : 24, Pics : |
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../kap_3/backbone/r3_2_1.pdf: To : From : 24, Pics : |
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../kap_3/advanced/t3_3_1.html: Surface Reconstruction To : 71, 122, 365, 25, 4, 366, From : 25, Pics : 4, 5, 146, 147, 148, 1, 6, 10, |
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../../mw1_ge/kap_5/backbone/r5_3_1.html: To : From : 25, 121, Pics : |
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../../mw1_ge/kap_2/backbone/r2_2_5.html: To : From : 25, 215, 303, Pics : |
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../../mw1_ge/kap_6/backbone/r6_2_1.html: To : From : 25, 207, Pics : |
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../../mw1_ge/kap_2/illustr/i2_1_1.html: To : From : 25, Pics : |
| -130 |
http://www.omicron.de/rom/current/index.html: From : 25, |
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../kap_3/illustr/i3_3_1.html: Some STM / AFM Pictures To : 4, 367, 25, From : 25, Pics : 4, 149, 1, 6, 10, |
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../kap_3/backbone/r3_3_1.pdf: To : From : 25, Pics : |
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../../mw1_ge/kap_8/backbone/r8.html: To : From : 26, 107, Pics : |
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../../mw2_ge/kap_5/backbone/r5_4_1.html: To : From : 26, Pics : |
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../../def_en/kap_8/advanced/t8_1_1.html: To : From : 26, Pics : |
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../kap_3/backbone/r3_4_1.pdf: To : From : 26, Pics : |
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../../mw1_ge/kap_7/backbone/r7_1_1.html: To : From : 27, 102, 107, Pics : |
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../kap_3/backbone/r3_5_1.pdf: To : From : 27, Pics : |
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../kap_4/backbone/r4_1_2.html: 4.1.2 Producing Semiconductor-Grade Silicon To : 368, 150, 369, 253, 4, 29, 141, 370, From : 28, 29, 37, 38, 47, 141, 150, 185, 188, 253, 369, Pics : 4, 5, 150, 151, 152, 1, 2, 3, 6, |
| 141 |
../kap_4/backbone/r4_1_3.html: 4.1.3 Silicon Crystal Growth and Wafer Production To : 371, 372, 373, 374, 375, 376, 377, 175, 378, 379, 380, 4, 140, 142, 381, From : 28, 30, 47, 140, 142, 175, 253, 371, 372, 373, 374, 375, 377, 378, 380, Pics : 4, 5, 153, 154, 155, 156, 1, 2, 3, 6, |
| 142 |
../kap_4/backbone/r4_1_4.html: 4.1.4 Summary to: 4.1 Input to Si Processing in an Industrial Environment To : 382, 4, 141, 30, 383, From : 28, 30, 141, 382, Pics : 4, 157, 5, 1, 2, 3, 6, |
| 143 |
../kap_4/backbone/r4_2_2.html: 4.2.2 No Need For Single Crystals To : 4, 30, 144, 384, From : 28, 30, 43, 144, Pics : 4, 5, 1, 2, 3, 6, |
| 144 |
../kap_4/backbone/r4_2_3.html: 4.2.3 Summary to: 4.2 Other Semiconductor Growth Technologies To : 385, 4, 143, 31, 386, From : 28, 31, 143, 385, Pics : 4, 5, 1, 2, 3, 6, |
| 145 |
../kap_4/backbone/r4_3_2.html: 4.3.2 Packaging and Testing To : 4, 31, 146, 387, From : 28, 31, 146, Pics : 4, 5, 1, 2, 3, 6, |
| 146 |
../kap_4/backbone/r4_3_3.html: 4.3.3 Working in Chip Development and Production To : 388, 4, 145, 147, 389, From : 28, 41, 145, 147, 388, Pics : 4, 5, 158, 1, 2, 3, 6, |
| 147 |
../kap_4/backbone/r4_3_4.html: 5.3.4 Generation Sequences To : 390, 29, 4, 146, 148, 391, From : 28, 146, 148, 390, Pics : 4, 5, 159, 1, 2, 3, 6, |
| 148 |
../kap_4/backbone/r4_3_5.html: 4.3.5 Summary to: 4.3 Infrastructure To : 392, 4, 147, 149, 393, From : 28, 147, 149, 392, Pics : 4, 160, 5, 1, 2, 3, 6, |
| 149 |
../kap_4/backbone/r4_4_1.html: 4.4.1 Summary to: 4. Getting Started To : 394, 395, 4, 148, 32, 396, From : 28, 32, 148, 394, 395, Pics : 4, 157, 5, 160, 1, 2, 3, 6, |
| 150 |
../kap_4/illustr/i4_1_1.html: Processes and Materials I To : 397, 4, 398, 29, 34, 140, From : 29, 34, 140, 397, Pics : 4, 161, 5, 1, 6, 10, |
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../kap_4/backbone/r4_1_1.pdf: To : From : 29, Pics : |
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../kap_3/advanced/t3_3_2.html: Nucleation Theory To : 104, 342, 399, 4, 400, 30, From : 30, 104, Pics : 4, 5, 133, 132, 1, 6, 10, |
| 153 |
../articles/iii-v_ii_vi_oxide_sic_ge/iii_vi/gaas_crystal_growth_2003.pdf: To : From : 30, Pics : |
| 154 |
../articles/eltran/eltran_what_is_soi.html: ELTRAN / ELTRAN WHAT'S SOI To : From : 30, 188, Pics : 162, 163, 164, 165, 166, |
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../kap_4/backbone/r4_2_1.pdf: To : From : 30, Pics : |
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../kap_4/illustr/i4_3_1.html: The Air We Breath To : 4, 401, 31, From : 31, Pics : 4, 167, 5, 1, 6, 10, |
| 157 |
../kap_4/advanced/t4_3_1.html: Cleanrooms To : 4, 402, 31, From : 31, Pics : 4, 168, 5, 169, 170, 171, 172, 1, 6, 10, |
| 158 |
../kap_4/illustr/i4_3_2.html: Cleanroom Garments To : 4, 403, 31, From : 31, Pics : 4, 173, 174, 175, 1, 6, 10, |
| 159 |
../kap_4/illustr/i4_3_3.html: Humans as Source of Particles To : 4, 404, 31, From : 31, Pics : 4, 176, 177, 178, 179, 180, 181, 1, 6, 10, |
| 160 |
../kap_4/illustr/i4_3_4.html: Particles on Chips To : 405, 406, 407, 408, 409, 410, 4, 411, 31, From : 31, 405, 406, 407, 408, 409, 410, Pics : 4, 5, 182, 183, 184, 185, 186, 187, 1, 6, 10, |
| 161 |
../../def_en/kap_6/illustr/i6_1_2.html: To : From : 31, Pics : |
| 162 |
../kap_4/illustr/i4_3_5.html: Electronic Materials in Unexpected Places To : 4, 412, 31, From : 31, Pics : 4, 188, 1, 6, 10, |
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../kap_4/backbone/r4_3_1.pdf: To : From : 31, Pics : |
| 164 |
../kap_5/backbone/r5_1_2.html: 5.1.2 Basic Concepts of Integrating Bipolar Transistors To : 33, 4, 165, 413, From : 32, 33, 38, 165, Pics : 4, 189, 5, 190, 191, 192, 193, 1, 2, 3, 6, |
| 165 |
../kap_5/backbone/r5_1_3.html: 5.1.3 Basic Concepts of Connecting Transistors To : 414, 415, 4, 164, 166, 416, From : 32, 37, 164, 166, 188, 206, 414, 415, Pics : 4, 5, 194, 195, 196, 197, 1, 2, 3, 6, |
| 166 |
../kap_5/backbone/r5_1_4.html: 5.1.4 Integrated MOS Transistors To : 415, 4, 165, 167, 417, From : 32, 37, 39, 165, 167, 187, 199, 204, 415, 448, 455, Pics : 4, 198, 5, 199, 200, 201, 202, 1, 2, 3, 6, |
| 167 |
../kap_5/backbone/r5_1_5.html: 5.1.5 Integrated CMOS Technology To : 415, 204, 418, 4, 166, 168, 419, From : 32, 34, 50, 166, 168, 184, 187, 204, 415, 418, 442, 448, Pics : 4, 5, 203, 204, 205, 206, 207, 1, 2, 3, 6, |
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../kap_5/backbone/r5_1_6.html: 5.1.6 Summary to: 5.1 Basic Considerations for Process Integration To : 420, 421, 4, 167, 34, 422, From : 32, 34, 167, 420, 421, Pics : 4, 5, 208, 209, 210, 211, 212, 213, 1, 2, 3, 6, |
| 169 |
../kap_5/backbone/r5_2_2.html: 5.2.2 Packaging and Testing of Silicon Chips To : 4, 34, 170, 423, From : 32, 34, 170, 188, Pics : 4, 5, 1, 2, 3, 6, |
| 170 |
../kap_5/backbone/r5_2_3.html: 5.2.3 Summary to: Chips on Wafers To : 424, 4, 169, 35, 425, From : 32, 35, 169, 424, Pics : 4, 52, 5, 1, 2, 3, 6, |
| 171 |
../kap_5/backbone/r5_4_1.html: 5.4 Summary to 5: Integrated Circuits - Process Integration To : 426, 427, 4, 35, 36, 428, From : 32, 35, 36, 426, 427, Pics : 4, 5, 208, 209, 210, 211, 212, 213, 1, 2, 3, 6, |
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../kap_5/basics/b5_1_1.html: Basic Bipolar Transistor To : 429, 94, 430, 274, 431, 4, 432, 33, 182, From : 33, 182, Pics : 4, 5, 214, 1, 6, 10, |
| 173 |
../kap_5/basics/b5_1_2.html: 5.0.2 Basic MOS Transistor To : 433, 434, 435, 27, 26, 4, 436, 33, 182, 260, From : 33, 182, 260, Pics : 4, 215, 5, 216, 217, 218, 219, 220, 1, 6, 10, |
| 174 |
../kap_5/backbone/r5_1_1.pdf: To : From : 33, Pics : |
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../kap_4/illustr/i4_1_8.html: Flats To : 29, 4, 437, 34, 141, From : 34, 141, Pics : 4, 5, 221, 1, 6, 10, |
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../kap_5/backbone/r5_2_1.pdf: To : From : 34, Pics : |
| 177 |
../kap_5/illustr/i5_3_1.html: Moore's Law: Break Down Scenarios To : 4, 438, 35, 193, 318, From : 35, 193, 318, Pics : 4, 222, 5, 223, 1, 6, 10, |
| 178 |
../kap_5/illustr/i5_3_2.html: Costs of Chip Production To : 4, 439, 35, From : 35, Pics : 4, 223, 5, 1, 6, 10, |
| 179 |
../kap_5/illustr/i5_3_3.html: Prize Decay for Memory Chips To : 4, 440, 35, From : 35, Pics : 4, 224, 5, 225, 1, 6, 10, |
| 180 |
../kap_5/illustr/i5_3_4.html: To : 35, 4, 441, From : 35, Pics : 4, 5, 226, 1, 6, 10, |
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../kap_5/backbone/r5_3_1.pdf: To : From : 35, Pics : |
| 182 |
../kap_6/backbone/r6_1_2.html: 6.1.2 LOCOS Process To : 172, 173, 442, 33, 443, 37, 444, 4, 183, 445, From : 36, 37, 172, 173, 183, 185, 442, 443, 444, 448, Pics : 4, 5, 227, 228, 229, 1, 2, 3, 6, |
| 183 |
../kap_6/backbone/r6_1_3.html: 6.1.3 Summary to: 6.1 Si Oxide and LOCOS Process To : 446, 4, 182, 38, 447, From : 36, 38, 182, 185, 446, Pics : 4, 5, 230, 1, 2, 3, 6, |
| 184 |
../kap_6/backbone/r6_2_2.html: 6.2.2 Oxide CVD To : 38, 448, 449, 450, 37, 167, 4, 185, 451, From : 36, 38, 185, 188, 215, 216, 448, 450, 455, Pics : 4, 5, 231, 232, 233, 1, 2, 3, 6, |
| 185 |
../kap_6/backbone/r6_2_3.html: 6.2.3 CVD for Poly-Silicon, Silicon Nitride and Miscellaneous Materials To : 38, 184, 205, 204, 37, 199, 182, 187, 140, 183, 4, 186, 452, From : 36, 39, 47, 184, 186, 199, 204, 205, 206, 216, Pics : 4, 5, 234, 235, 1, 2, 3, 6, |
| 186 |
../kap_6/backbone/r6_2_4.html: 6.2.4 Summary to: 6.2 Chemical Vapor Deposition To : 453, 4, 185, 39, 454, From : 36, 39, 185, 453, Pics : 4, 5, 1, 2, 3, 6, |
| 187 |
../kap_6/backbone/r6_3_2.html: 6.3.2 Ion Implantation To : 167, 166, 455, 456, 35, 37, 4, 39, 188, 457, From : 36, 39, 185, 188, 229, 455, 456, Pics : 4, 5, 236, 237, 1, 2, 3, 6, |
| 188 |
../kap_6/backbone/r6_3_3.html: 6.3.3 Miscellaneous Techniques and Comparison To : 39, 165, 414, 458, 273, 154, 459, 21, 460, 169, 140, 184, 4, 187, 189, 461, From : 36, 37, 39, 187, 189, 414, 455, Pics : 4, 5, 238, 239, 240, 235, 241, 242, 1, 2, 3, 6, |
| 189 |
../kap_6/backbone/r6_3_4.html: 6.3.4 Summary to: 6.3 Physical Processes for Layer Deposition To : 208, 4, 188, 40, 462, From : 36, 40, 188, 208, 215, Pics : 4, 243, 5, 244, 245, 1, 2, 3, 6, |
| 190 |
../kap_6/backbone/r6_4_2.html: 6.4.1 Etching Techniques To : 34, 463, 464, 4, 40, 191, 465, From : 36, 40, 191, 463, Pics : 4, 5, 246, 1, 2, 3, 6, |
| 191 |
../kap_6/backbone/r6_4_3.html: 6.4.3 Plasma Etching To : 466, 4, 190, 192, 467, From : 36, 190, 192, 216, 229, 466, Pics : 4, 5, 247, 248, 249, 1, 2, 3, 6, |
| 192 |
../kap_6/backbone/r6_4_4.html: 6.4.4 Summary to: 6.4 Etching Techniques To : 4, 191, 41, 468, From : 36, 41, 191, Pics : 4, 250, 5, 251, 247, 1, 2, 3, 6, |
| 193 |
../kap_6/backbone/r6_5_2.html: 6.5.2 Resist and Steppers To : 31, 41, 204, 469, 177, 35, 4, 194, 470, From : 36, 41, 177, 194, 204, 469, Pics : 4, 5, 252, 253, 254, 1, 2, 3, 6, |
| 194 |
../kap_6/backbone/r6_5_3.html: 6.5.3 Summary to: 6.5 Lithograpy To : 4, 193, 195, 471, From : 36, 193, 195, Pics : 4, 255, 5, 256, 1, 2, 3, 6, |
| 195 |
../kap_6/backbone/r6_6_1.html: 6.6 Summary: Materials and Processes for Silicon Technology To : 472, 4, 194, 42, 473, From : 36, 42, 194, 472, Pics : 4, 5, 230, 243, 244, 245, 250, 251, 247, 255, 256, 1, 2, 3, 6, |
| 196 |
../kap_6/illustr/i6_1_1.html: Forms of SiO2 To : 4, 474, 37, From : 37, Pics : 4, 5, 257, 1, 6, 10, |
| 197 |
../../mw1_ge/kap_3/advanced/t3_3_3.html: To : From : 37, Pics : |
| 198 |
../kap_6/advanced/t6_1_1.html: Electrical Breakdown and Failure of Dielectrics To : 335, 4, 475, 37, From : 37, Pics : 4, 5, 258, 259, 1, 6, 10, |
| 199 |
../kap_6/illustr/i6_1_2.html: HRTEM of Gateoxide and ONO To : 166, 39, 4, 476, 37, 185, From : 37, 185, Pics : 4, 5, 260, 261, 1, 6, 10, |
| 200 |
../../semi_en/kap_2/illustr/i2_3_2.html: To : From : 37, Pics : |
| 201 |
../kap_6/illustr/i6_1_3.html: Furnaces To : -477, -478, 4, 479, 37, From : 37, Pics : 4, 5, 262, 263, 264, 265, 266, 1, 6, 10, |
| 202 |
../kap_6/backbone/r6_1_1.pdf: To : From : 37, Pics : |
| 203 |
../kap_6/backbone/r6_2_1.pdf: To : From : 38, Pics : |
| 204 |
../kap_5/illustr/i5_1_1.html: Cross Section of 16 Mbit DRAM and 64 Mbit DRAM To : 166, 4, 480, 39, 167, 185, 193, 481, From : 39, 167, 185, 193, 481, Pics : 4, 267, 268, 269, 5, 1, 6, 10, |
| 205 |
../kap_6/illustr/i6_3_1.html: Requirements for Chip Metallization To : 4, 482, 39, 185, From : 39, 185, 455, Pics : 4, 5, 270, 271, 1, 6, 10, |
| 206 |
../kap_6/advanced/t6_3_1.html: Spiking and Epitaxial Si in Contact Holes To : 165, 483, 185, 207, 4, 484, 39, From : 39, 207, Pics : 4, 5, 272, 273, 274, 275, 276, 277, 278, 1, 6, 10, |
| 207 |
../kap_6/advanced/t6_3_2.html: Electromigration To : 124, 206, 4, 485, 39, From : 39, 206, Pics : 4, 5, 279, 1, 6, 10, |
| 208 |
../kap_6/exercise/c6_3_1.html: 6.3.1 Physical Processes for Layer Depositions - Summary To : 4, 486, 39, 189, From : 39, 189, Pics : 1, 6, 10, |
| 209 |
../kap_6/backbone/r6_3_1.pdf: To : From : 39, Pics : |
| 210 |
../kap_6/backbone/r6_4_1.pdf: To : From : 40, Pics : |
| 211 |
../kap_6/backbone/r6_5_1.pdf: To : From : 41, Pics : |
| 212 |
../kap_7/backbone/r7_1_2.html: 7.1.2 A Closer Look at a Gyro To : 43, 487, 488, 4, 213, 489, From : 42, 43, 44, 213, 215, 216, Pics : 4, 5, 280, 281, 282, 283, 284, 285, 1, 2, 3, 6, |
| 213 |
../kap_7/backbone/r7_1_3.html: 7.1.3 MEMS Sensors and Actuators To : 43, 212, 490, 491, 492, 493, 266, 39, 4, 214, 494, From : 42, 44, 212, 214, 216, 492, 495, 501, Pics : 4, 5, 286, 287, 288, 289, 290, 291, 1, 2, 3, 6, |
| 214 |
../kap_7/backbone/r7_1_4.html: 7.1.4 Summary to: 7.1 MEMS - Products and Developments To : 495, 4, 213, 44, 496, From : 42, 44, 213, 495, Pics : 4, 292, 293, 5, 294, 1, 2, 3, 6, |
| 215 |
../kap_7/backbone/r7_2_2.html: 7.2.1 Important MEMS Processes To : 40, 44, 21, 7, 466, 189, 184, 212, 225, 123, 4, 216, 497, From : 42, 44, 47, 216, 225, 466, Pics : 4, 5, 295, 296, 297, 298, 299, 300, 301, 302, 303, 304, 1, 2, 3, 6, |
| 216 |
../kap_7/backbone/r7_2_3.html: 7.2.3 Example for Process Integration To : 212, 213, 37, 185, 41, 191, 215, 184, 38, 225, 44, 4, 217, 498, From : 42, 215, 217, 225, 229, Pics : 4, 5, 305, 306, 307, 308, 309, 310, 311, 312, 313, 314, 315, 1, 2, 3, 6, |
| 217 |
../kap_7/backbone/r7_2_4.html: 7.2.4 Summary to: 7.2 Processes and Specialities To : 499, 4, 216, 218, 500, From : 42, 216, 218, 499, Pics : 4, 316, 317, 5, 306, 1, 2, 3, 6, |
| 218 |
../kap_7/backbone/r7_3_1.html: 7.3.1 Summary to: 7. MEMS To : 501, 4, 217, 45, 502, From : 42, 45, 217, 501, Pics : 4, 292, 293, 5, 294, 316, 317, 306, 1, 2, 3, 6, |
| 219 |
../kap_7/illustr/i7_1_1.html: MEMS Market To : 43, 4, 503, From : 43, Pics : 4, 5, 318, 319, 1, 6, 10, |
| 220 |
../kap_7/illustr/product_info_g_sensor_bosch.pdf: To : From : 43, Pics : |
| 221 |
../kap_7/illustr/i7_1_2.html: The Texas Instrument DLP Chip To : 4, 504, 43, 50, From : 43, 50, Pics : 4, 320, 5, 321, 1, 6, 10, |
| 222 |
../kap_7/illustr/i7_1_3.html: RF MEMS To : -505, 4, 506, 43, From : 43, Pics : 4, 5, 322, 1, 6, 10, |
| 223 |
../kap_7/advanced/t7_1_3.html: Casimir Effect To : 4, 507, 43, From : 43, Pics : 4, 5, 1, 6, 10, |
| 224 |
../kap_7/backbone/r7_1_1.pdf: To : From : 43, Pics : |
| 225 |
../kap_7/advanced/t7_2_1.html: Stiction To : 21, 4, 508, 44, 215, 216, From : 44, 215, 216, Pics : 4, 5, 323, 1, 6, 10, |
| 226 |
../kap_7/backbone/r7_2_1.pdf: To : From : 44, Pics : |
| 227 |
../kap_8/backbone/r8_1_2.html: 8.1.2 Solar Cell Current-Voltage Characteristics and Equivalent Circuit Diagram To : 46, 509, 510, 251, 511, 512, 513, 4, 228, 514, From : 45, 46, 228, 229, 231, 251, 509, 510, 512, 513, Pics : 4, 5, 324, 325, 326, 327, 328, 329, 330, 1, 2, 3, 6, |
| 228 |
../kap_8/backbone/r8_1_3.html: 8.1.3 Summary to: 8.1 Solar Cells - General Concerns To : 515, 4, 227, 47, 516, From : 45, 47, 227, 515, Pics : 4, 331, 332, 5, 333, 334, 335, 1, 2, 3, 6, |
| 229 |
../kap_8/backbone/r8_2_2.html: 8.2.2 Processes and Process Integration To : 31, 187, 216, 191, 517, 39, 41, 40, 227, 253, 4, 47, 230, 518, From : 45, 47, 48, 230, 253, Pics : 4, 5, 336, 337, 338, 339, 340, 341, 342, 343, 1, 2, 3, 6, |
| 230 |
../kap_8/backbone/r8_2_3.html: 8.2.3 Summary to: 8.2 Making Bulk Si Solar Cells To : 519, 4, 229, 48, 520, From : 45, 48, 229, 519, Pics : 4, 5, 344, 343, 1, 2, 3, 6, |
| 231 |
../kap_8/backbone/r8_3_2.html: 8.3.2 Essentials of Producing Thin Film Solar Cells To : 48, 51, 46, 36, 227, 521, 4, 232, 522, From : 45, 46, 48, 232, 521, Pics : 4, 5, 345, 346, 1, 2, 3, 6, |
| 232 |
../kap_8/backbone/r8_3_3.html: 8.3.3 Summary to: 8.3 Making Thin Film Solar Cells To : 523, 4, 231, 233, 524, From : 45, 231, 233, 523, Pics : 4, 347, 348, 5, 349, 1, 2, 3, 6, |
| 233 |
../kap_8/backbone/r8_4_1.html: 8.4.1 Summary to: 8 Solar Cells To : 525, 4, 232, 49, 526, From : 45, 49, 232, 525, Pics : 4, 331, 332, 5, 333, 334, 335, 344, 343, 347, 348, 349, 1, 2, 3, 6, |
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../kap_4/advanced/t4_1_1.html: The Great Si Crisis in 2007 To : 240, 140, 544, 141, 368, 4, 545, 47, 229, 369, From : 47, 140, 229, 369, Pics : 4, 5, 357, 1, 6, 10, |
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../kap_9/backbone/r9_2_2.html: 9.2.2 Laser Diodes To : 552, 173, 553, 88, 51, 554, 258, 4, 261, 555, From : 49, 51, 173, 258, 261, 554, Pics : 4, 5, 365, 366, 367, 368, 369, 370, 371, 372, 373, 374, 1, 2, 3, 6, |
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../overview_main_1.html: Semiconductor Technology: Overview To : -278, -279, 280, 281, 9, 4, 2, 568, 52, 283, 16, 284, 285, 286, From : 53, Pics : 386, 4, 5, 106, |
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../kap_2/backbone/r2_4_3.html: 2.4.3 CuInSe2 and other Chalcogenides To : 574, 575, 255, 19, 4, 63, 64, 576, From : 63, 64, Pics : 4, 5, 1, 2, 3, 6, |
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../kap_2/exercise/q2_6_1.html: Exercise 2.6-1: All Quick Questions / Class Exercises to: 2. Semiconductor Materials and Products To : 17, 56, 57, 18, 59, 19, 4, 578, 67, From : 67, Pics : 4, 5, 1, 6, 10, |
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../kap_2/exercise/sq2_2_1.html: Solution to Exercise 2.2-1 To : 18, 177, 3, 59, 42, 569, 296, 4, 580, 85, From : 85, 177, 296, Pics : 4, 5, 1, 6, 10, |
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../kap_4/illustr/i4_1_5.html: Czochralski Crystal Growth Process To : 141, 377, 4, 592, 371, 374, From : 141, 371, 374, 377, Pics : 4, 5, 399, 400, 401, 1, 6, 10, |
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../kap_4/illustr/i4_1_6.html: Necking To : 593, 373, 375, 4, 594, 141, 377, From : 141, 373, 375, 377, Pics : 4, 5, 402, 1, 6, 10, |
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../kap_4/advanced/t4_1_3.html: The Science and Art of Si Crystal Growth To : 374, 595, 141, 4, 596, From : 141, 374, Pics : 4, 5, 399, 400, 401, 403, 1, 6, 10, |
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../kap_4/illustr/i4_1_9.html: Complete Wafer Process To : 4, 598, 141, From : 141, Pics : 4, 5, 405, 406, 1, 6, 10, |
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../kap_4/illustr/i4_1_10.html: Commercial Wafer Specifications To : 4, 599, 141, From : 141, Pics : 4, 5, 407, 1, 6, 10, |
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../kap_4/exercise/e4_1_1.html: Exercise 4.1-1: Quick Questions to 4.1 Input to Si Processing in an Industrial Environment To : 4, 600, 142, From : 142, Pics : 4, 5, 408, 1, 6, 10, |
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../kap_4/exercise/c4_4_1.html: MC 4. Getting Started To : 4, 606, 149, From : 149, Pics : 1, 6, 10, |
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../kap_4/illustr/i4_1_2.html: Processes and Materials II To : 607, 4, 608, 150, From : 150, 607, Pics : 4, 5, 417, 1, 6, 10, |
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../kap_6/advanced/t6_3_4.html: Doping Trench walls To : 166, 38, 188, 184, 37, 481, 4, 633, 187, 205, From : 187, 481, Pics : 4, 5, 434, 435, 1, 6, 10, |
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../kap_6/illustr/i6_4_1.html: Loosing Large Amounts of Money with Wet Chemistry To : 635, 4, 636, 190, From : 190, Pics : 4, 5, 1, 6, 10, |
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../kap_7/exercise/e7_1_2.html: Exercise Basic 7.1-2 Capacitors and Forces To : 213, 642, 4, 643, From : 213, 642, Pics : 4, 5, 450, 113, 1, 6, 10, |
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../kap_7/exercise/e7_2_1.html: Exercise Basic 7.2-1Class Exercises and Quick Questions to 7.1 MEMS - Products and Developments To : 4, 646, 217, From : 217, 645, Pics : 4, 5, 1, 6, 10, |
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../kap_7/exercise/e7_3_1.html: Exercise Basic 7.1-1Class Exercises and Quick Questions to 7.1 MEMS - Products and Developments To : 43, 44, 213, 4, 647, 218, 642, 645, From : 218, Pics : 4, 5, 1, 6, 10, |
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| 510 |
../kap_8/exercise/s8_1_3.html: Solution to Exercise 8.1-3: Characteristics of Real Solar Cells To : 248, 251, 46, 247, 649, 4, 650, 227, 250, 509, 538, From : 227, 248, 250, 251, 509, Pics : 4, 327, 5, 451, 452, 453, 454, 1, 6, 10, |
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| 513 |
../kap_8/advanced/t8_1_4.html: CELLO To : 652, 653, 4, 654, 227, From : 227, Pics : 4, 5, 1, 6, 10, |
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../kap_8/exercise/e8_1_4.html: Exercise Basic 8.1-4 Quick Questions to 8.1 Solar Cells - General Concerns To : 4, 655, 228, From : 228, Pics : 4, 5, 1, 6, 10, |
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| 525 |
../kap_8/exercise/e8_4_1.html: Exercise 8.4-1 All Quick Questions to: 8. Solar Cells To : 4, 660, 233, From : 233, Pics : 4, 5, 1, 6, 10, |
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| 529 |
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| 530 |
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| 535 |
../kap_8/exercise/s8_1_5.html: Solution to Exercise 8.1-5 IV Characteristics of Real Solar Cells To : 249, 4, 663, 248, From : 248, 249, 521, 530, Pics : 4, 1, 6, 10, |
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| 538 |
../kap_8/exercise/e8_1_6.html: Exercise 8.1-6 Constructing Quantitative Logarithmic IV Characteristics To : 539, 4, 664, 249, From : 249, 510, 539, Pics : 4, 5, 113, 1, 6, 10, |
| 539 |
../kap_8/exercise/s8_1_6.html: Solution to Exercise 8.1-6 Constructing Quantitative Logarithmic IV Characteristics To : 4, 665, 249, 538, From : 249, 521, 530, 538, Pics : 4, 5, 355, 458, 1, 6, 10, |
| 540 |
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| 541 |
../kap_8/exercise/s8_1_2.html: Solution to Exercise 8.1-3: Characteristics of Real Solar Cells To : 4, 666, 250, From : 250, Pics : 4, 459, 5, 1, 6, 10, |
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| -546 |
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| -547 |
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| 549 |
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| 550 |
../kap_9/exercise/e9_1_1.html: 9.1.1 - Optoelectronics - General Concerns To : 4, 667, 259, From : 259, Pics : 4, 5, 1, 6, 10, |
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| 554 |
../kap_9/advanced/t9_2_2.html: Cleaving Semiconductors for (Blue) Lasers Diodes To : 30, 26, 260, 4, 668, From : 260, Pics : 4, 5, 460, 461, 1, 6, 10, |
| 555 |
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| 556 |
../kap_9/exercise/e9_2_1.html: 9.2.1 - Optoelectronics - Important Principles and Technologies To : 4, 669, 261, From : 261, Pics : 4, 5, 462, 463, 1, 6, 10, |
| 557 |
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| 558 |
../kap_9/exercise/e9_3_1.html: Exercise 9.3-1 All Quick Questions to 9. Optoelectronics To : 4, 670, 262, From : 262, Pics : 4, 5, 462, 463, 1, 6, 10, |
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| 568 |
../pecularities.html: Pecularities of Hyperscripts To : 287, 288, 289, 290, 16, 2, 12, 3, From : 282, Pics : 4, 5, 1, |
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../kap_7/exercise/s7_1_2.html: Solution to Exercise 7.1-2 Forces in Capacitive Structures To : 4, 674, 492, From : 492, 495, 501, Pics : 4, 450, 5, 1, 6, 10, |
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../kap_7/exercise/s7_1_1.html: Solution to Exercise 7.1-1: Summing up some Class Exercises: To : 4, 675, 495, 499, From : 495, 501, Pics : 4, 5, 1, 6, 10, |
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../kap_8/exercise/s8_3_1.html: Solution to Exercise 8.3-1: Making In-Situ Series Connections To : 4, 676, 521, 530, From : 521, Pics : 4, 5, 466, 467, 468, 1, 6, 10, |
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../kap_5/illustr/i5_2_3.html: Processes and Materials III To : 4, 677, 630, From : 630, Pics : 4, 5, 469, 1, 6, 10, |
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| 305 |
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| 357 |
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