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Chemical etching:
Relatively simple, with luck extremely selective, relatively
fast, but: | |
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Material removal always isotropic (see figure) and thus enlarging features and
thus not applicable to "micro" or better "nano" structuring |
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Might be extremely dangerous (corrosive, poisonous, inflammable, explosive, ... ) and often
hard to recycle / dispose off. | |
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Plasma Etching:
Simple in principle (see figure) quite complex and expensive
in praxis. | |
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Given the right plasma (not easy to find; plasma chemistry counts among the "black arts"),
the etching can be completely anisotropic and sufficiently selective. |
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Innumerable variants exist and new methods are coming up all the time. Definitely on of the
key technologies for micro / nano technology. | |
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© H. Föll (Electronic Materials - Script)
